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dc.contributor.authorHarrey, PM-
dc.contributor.authorEvans, PSA-
dc.contributor.authorHarrison, DJ-
dc.identifier.citationIEEE Transactions on Electronic Packaging and Manufacturing. 24(4): 333-338, Oct 2002en
dc.description.abstractThis paper reports on fabrication of low-value embedded capacitors in conductive lithographic film (CLF) circuit boards. The CLF process is a low-cost and high speed manufacturing technique for flexible circuits and systems. We report on the construction and electrical characteristics of CLF capacitor structures printed onto flexible substrates. These components comprise a single polyester dielectric layer, which separates the printed electrode films. Multilayer circuit boards with printed components and interconnect can be fabricated using this technique.en
dc.format.extent100350 bytes-
dc.subjectConductive lithographic filmsen
dc.subjectEmbedded capacitors-
dc.subjectFlexible circuits-
dc.subjectIntegrated passive components-
dc.subjectMultilayer circuits-
dc.titleIntegrated capacitors for conductive lithographic film circuitsen
dc.typeResearch Paperen
Appears in Collections:Design
Dept of Design Research Papers

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