Please use this identifier to cite or link to this item: http://buratest.brunel.ac.uk/handle/2438/1766
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dc.contributor.authorHarrey, PM-
dc.contributor.authorEvans, PSA-
dc.contributor.authorHarrison, DJ-
dc.coverage.spatial6en
dc.date.accessioned2008-02-29T16:44:33Z-
dc.date.available2008-02-29T16:44:33Z-
dc.date.issued2001-
dc.identifier.citationIEEE Transactions on Electronic Packaging and Manufacturing. 24(4): 333-338, Oct 2002en
dc.identifier.issn1521-334X-
dc.identifier.urihttp://bura.brunel.ac.uk/handle/2438/1766-
dc.description.abstractThis paper reports on fabrication of low-value embedded capacitors in conductive lithographic film (CLF) circuit boards. The CLF process is a low-cost and high speed manufacturing technique for flexible circuits and systems. We report on the construction and electrical characteristics of CLF capacitor structures printed onto flexible substrates. These components comprise a single polyester dielectric layer, which separates the printed electrode films. Multilayer circuit boards with printed components and interconnect can be fabricated using this technique.en
dc.format.extent100350 bytes-
dc.format.mimetypeapplication/pdf-
dc.language.isoen-
dc.publisherIEEEen
dc.subjectConductive lithographic filmsen
dc.subjectEmbedded capacitors-
dc.subjectFlexible circuits-
dc.subjectIntegrated passive components-
dc.subjectMultilayer circuits-
dc.titleIntegrated capacitors for conductive lithographic film circuitsen
dc.typeResearch Paperen
dc.identifier.doihttp://dx.doi.org/10.1109/6104.980043-
Appears in Collections:Design
Dept of Design Research Papers

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